High-accuracy inner lead bonding technique

Miniaturizing electronic apparatus requires the interconnection of high-pin-count IC dies to finely pitched leads. However, conventional wire bonding does not meet this requirement. Tape automated bonding has been employed to achieve high-pin-count and high-density packaging. A fully automated inner lead bonder has been developed. Using this machine, bonding accuracy and bond strength have been investigated. The results obtained indicate that the bonding accuracy is good and that the bonding condition range is wide. This technique has been applied to LCD display module mass production.<>