A new idea of effective cooling of integrated circuits

The purpose of this paper is the thermal analysis of the structure consisting of integrated circuit, heat sink, additional temperature sensor and active fan in which the power dissipation is used as the control parameter to get both maximum throughput of a microprocessor and energy saving. It focuses on adjustment of convection coefficient (in other word adjustment of fan rotation speed) at heat sink level with respect to the amount of power dissipated by the chip and environmental circumstances. The duality between electrical and thermal parameters enables to model the RC thermal network of the structure. Therefore, the dynamic thermal behaviour of the integrated system is investigated by utilizing the RC compact model, which is implemented in Spice environment. The simulation result indicates the case of short temperature peak whenever the power dissipation changes. The benefit of this approach is the rapid removal of internal chip energy accumulation due to the adjustment of fan speed. Consequently the cooling system's energy consumption can be minimized, what enhances reliability and efficiency of integrated circuit.