ESD optimization with on-chip and on-board codesign ESD protection strategy for mixed signal system in package

A mixed-signal data acquisition system with multi-channel ADC is introduced in this work. The ESD Co-design methodology for on-chip and on-board components are analyzed for ESD HBM failure on the input film resistor with the size of 0402. By investigating the on-chip protection structure and the parasitic effect of the onboard components, popular diodes 1N4148 are integrated on the substrate to shunt the ESD current avoiding destroy the input resistors. The ESD robustness of the SiP is improved from 600V to 2500V with the same size package and the same electronic performance.