High reliable wire bonding technology in microwave module packaging

Wire bonding technology has been used extensively in making electrical connections in microwave module. In microwave module, wire bonding technology is one of the key process, RF consistency, reliability and lifetime of microwave module is influenced directly by quality of wire bonding technology. Factors influencing quality of wire bonding technology in microwave module is studied in the paper. The analysis results indicate that the factors influencing wire bonding are bonding materials, bond parameters, bonding surface quality and bonding wedge. According to gold wire bonding in microwave module, proper bonding materials, bond parameters, bonding surface quality and bonding wedge were obtained, gold wires were bonded with good stability, which can meet the needs of gold wire bonding used in microwave module.