A simplification method of TSV interposer for thermal analysis in 3D packages

In this paper a simplification method of TSV interposer for thermal analysis was proposed. In order to analyze the accuracy of this simplification method, the actual model and corresponding equivalent model with 100 TSVs were established by using ANSYS Workbench software. In this study, the error of simplification method with various TSV diameters, TSV pitches have been determined. Conclusions are made that the equivalent model can accurately reflect the actual temperature distribution. The max equivalent error will be less than ± 10%, respectively.