Thermal modeling and analysis on a novel no-substrate LEDCOB module

In this paper a novel package structure of chip on board (COB) LED is proposed. Compared with the normal COB with a large number of layer structures, the substrate is removed in the novel. So the LED chip can directly bonded to the radiator, the cooling path is also effectively reduced. The heat generated by the chip can directly dissipate to the outside through the radiator. Then two kinds of finite element modules of LED package are established and simulated by ANSYS software, respectively. From the thermal analysis results, the junction temperature of the proposed module is 15°C lower than the normal one in the case of 4×4 modules, and the temperature distribution is also more uniform; from the thermal stress analysis results, the maximum stress of the novel is 55.0MPa lower than the normal in the case of 4×4 modules. So the results demonstrate the novel module structure of LEDCOB has a better heat dissipation and a lower thermal stress. And the results also provide a better suggestion for designing LED module structure in the future.