Impack of crosstalk on signal integrity of high density ceramic package for IC

With the rapid development of high density packaging technology, signal integrity of packages has become a hot research field. The signal integrity related problems, including noises (Delay, Reflection, Crosstalk between different line, etc.), bus timing design and power integrity issues, may seriously affect the performance of whole electronic system and even cause this system fail to work. This article is based on basic theory of the signal integrity at high - speed circuit transmission line, use the method of test and simulation to study the near-end crosstalk and far-end crosstalk among signal lines. Test and analysis the crosstalk at large scale integrated circuit package CQFP240M. Build micro-strip line and strip-line model through simulation software, to simulate and test the influence factors of crosstalk between adjacent transmission lines. And put forward crosstalk reduction method and optimized design rule according to the simulation results.