Synthesis and characterization of ultra-fine bimetallic Ag-Cu nanoparticles as die attach materials

In this paper, we propose an facile one-step reduction approach free of microwave-assisted heating or water-bath heating to synthesize Ag-Cu nanoparticles (NPs). Results showed that fcc Ag-Cu NPs with an ultra-fine average size of 9 nm were achieved and expected to sinter at about 330°C which is much lower than the eutectic temperature of bulk Ag-Cu alloy (779°C) according to the analysis of TG/DSC. This study provided a new SiC die attach materials with good properties at high temperature.