MEMS-Based Tunable TSV Inductors

In this paper, we present a Through-Silicon-Via (TSV)-based 3D tunable inductor for multiple band filter applications. MEMS (Micro Electro-Mechanical Systems)-based switches are implemented to vary inductance by activating and deactivating the switches. MEMS-based switches are fabricated and modeled to implement the tunable inductor. Detailed 3D full-wave simulation results are presented for different frequency bands.