Wafer-Level Fabrication of Silicon-in-Glass Electrodes for Electrostatic Transduction

Here we present the fabrication process for silicon-in-glass electrodes as capacitive transducers. The embedded electrodes are formed by utilizing a glass reflow process. DRIE process easily defines the number and shape of these embedded silicon electrodes. Eight, sixteen, twenty-four electrodes are obtained through this process. These silicon-in-glass electrodes are anticipated to be operated to measure the out-of-plane motion of shell resonators.