Die Attach Material for Power Semiconductor Having Nano-Level Sn-Cu Diffusion Control

This paper discloses development and evaluation of die attach material using base metals (Cu and Sn) by three different type of composite. Mixing them into paste or sheet shape for die attach, we have confirmed that one of Sn-Cu components having IMC network near its surface has major role to provide robust interconnect especially for high temperature applications beyond 200°C after sintering.