Panel Level Advanced Packaging

Advanced packaging technology is the catalyst that enables greater chip connectivity needed for the never-ending quest for more powerful mobile devices, tablets, Internet of Things (IoT) and wearable devices with increased functionality that operate with lower power requirements for extended battery life but remain available at low cost. The evolution of advanced packaging to incorporate 2.5D and 3D processes into production space puts additional pressure upon outsourced assembly and test (OSAT) facilities and foundries to maintain costs and production efficiencies and accentuates the opportunity to move from manufacturing advanced packaging on circular wafers to rectangular substrates e.g. panel level advanced packaging. Migrating from circular wafers to rectangular substrates provides OSATs with the means to process more die per substrate to increase productivity and yield while reducing manufacturing costs. This paper demonstrates panel level advanced packaging on rectangular substrates is practicable. Lithographic results for resolution and overlay imaged on rectangular substrates populated with test die will be presented. Specific requirements and challenges encountered for successful registration between layers are discussed, along with solutions that were implemented to meet the design goals. Challenges that remain will also be highlighted. Panel level advanced packaging throughput advantages will also be reviewed. Throughput achieved on rectangular substrates will be presented and compared to throughput for similar devices on circular wafers. Throughput will be analyzed to demonstrate why throughput on a rectangular substrates is advantageous over circular wafers with review of panel level advanced packaging enabling the population of whole die in the corners of the panel without the loss of partial die experienced on the radius of a circular substrate. Reduction in nonproductive overhead to manufacturing equipment when panel level advanced packaging is adopted will also be presented.