Wireless power transfer through metallic barriers enclosing a harsh environment; feasibility and preliminary results | IEEE Conference Publication | IEEE Xplore

Wireless power transfer through metallic barriers enclosing a harsh environment; feasibility and preliminary results


Abstract:

Modern sensor networks are evolving toward wireless interfaces for both power and data transmission. Design of these devices is challenging, especially when both power an...Show More

Abstract:

Modern sensor networks are evolving toward wireless interfaces for both power and data transmission. Design of these devices is challenging, especially when both power and data transmission must reach a harsh environment subject to high temperature, high pressure and through thick metallic layers. This paper reports the design and simulation of an inductive power transfer (IPT) system, which characterizes achievable link efficiency. The problem formulation comes from a family of aerospace applications in which electronic must operate at high temperature (500°C) and high pressure (100 bar) and in which a metal casing (15mm thick) isolates the harsh environment from the environment. Specifically, the requirements of booster rockets in aerospace industry are considered. The proposed IPT system was modeled and simulate d using COMSOL. Reported results demonstrate the feasibility of wirelessly transferring power to a high temperature and high pressure zone through various metallic layers using custom electromagnetic link configurations. Power transfer efficiencies of 38% and 15.5% are reported with Titanium and Steel metal booster interfaces at resonance frequencies of 450Hz and 220Hz respectively.
Date of Conference: 22-25 May 2016
Date Added to IEEE Xplore: 11 August 2016
ISBN Information:
Electronic ISSN: 2379-447X
Conference Location: Montreal, QC, Canada

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