Rework of Wire Bonded Devices on Mcms

The rework of wire bonded devices on MCMs (Multi Chip Modules) has historically been a manual procedure that has been time consuming and prone to operator error. This paper describes a complete rework process from the removal of the wires and device to the die attach material. The wires are removed using the Harmonicair/sup TM/. The Harmonicair leaves a very repeatable wire remnant on the substrate bond pad to facilitate the bonding of the next wire. The device is removed with a tensile process and the die attach material is then removed through a controlled shaving process.