Hybrid large-area systems: Challenges in interfacing

Hybrid large-area systems aim to leverage the strengths of two complementary technologies: (1) large-area electronics (LAE), which enables dense arrays of diverse transducers on substrates that can be large and flexible; and (2) silicon CMOS ICs, which enable efficient and high-performance instrumentation, computation, and power management. A key challenge in realizing these hybrid systems on a large-scale lies in the interfacing required between the two technologies. We describe methods to ease the interfacing, enabled by device, circuit, and algorithmic advances, thereby suggesting a range of challenges and opportunities that are exposed when thinking about systems.