Capacitive coupling analysis using double-surface ICs for low cost passive RFID tags

This paper introduces a new concept of liquid phase inkjet-based fabrication process for low cost, low range and high throughput Radio Frequency Identification (RFID) tags. In this research, passive chips have one pad on the top of the chip and the back of the silicon die (bulk) acting as the second pad. Such a chip can be delivered, using an inkjet-based process, onto one pad of an antenna instead to be precisely placed using flip-chip method. This allows producing RFID tag only with printing steps, reducing considerably the assembly and hence the overall costs. We demonstrate the feasibility of this approach by analyzing the capacitive coupling obtained using double-surface chips.