Monolithic integration of multiple sensors on a single silicon chip

We present a monolithic integration of multiple sensors that have various structures and different packages. The multi sensors include an electrical field sensor (EFS) and accelerometers in a vacuum package and pressure, humidity, temperature sensors with direct contact with environment. To conduct the electrical signals from the vacuum package, three-dimensional (3-D) integration is implemented with a silicon interposer with through-silicon-vias (TSVs). The configuration of the multi sensor system, the co-design and co-fabrication, and packaging schemes are presented.