On the electrical performance of rigid silicon interposer

Direct integration of rigid silicon interposer on PCB is emerging as a viable solution to reduce the costs associated with 2.5D/3D integration of fine pitch devices. Unlike conventional 2.5D/3D integration where a thin silicon interposer with 10:100 aspect ratio is assembled on an organic package substrate with subsequent package assembly on a PCB, rigid silicon interposer can be directly assembled on a PCB, thereby significantly reducing the costs of 2.5D/3D integration. Previous studies has demonstrated the economics and reliability of rigid silicon interposer, in this manuscript we demonstrate the performance gain of DDR4 memory signaling as well as high speed SER/DES on 2.5D/3D rigid silicon interposer compared to conventional 2.5/3D integration. We will further discuss the security advantages of rigid silicon interposer compared to conventional interposer based integration.