A highly integrated full SiC six-pack power module for automotive applications

A thick-film-based, full SiC, low inductance six-pack power module with integrated gate-drive circuits and DC-link capacitors is presented. Thermal simulations are conducted with COMSOL Multiphysics in order to determine the temperature distribution within the power module as well as its thermal resistance. For thermal characterisation the surface temperature distribution of the power module is scanned by infrared photography and the thermal resistance from junction to the thermal interface layer is determined. The measured values differ from the simulated results by 12 % to 20 % due to the deviating thermal properties of the materials and the measurement error of the utilised infrared camera.