Design of a packaging machine and virtual commissioning via modular hardware-in-the-loop simulations

This paper describes an implementation of a model-based methodology to validate an innovative Hardware-in-the-loop (HIL) scheme applied to a mechatronic modular structure for a packaging machine. This new HIL environment is implemented by means of a unique CPU and allows use of an ordinary personal computer for the HIL simulation of a module of the packaging machine, without any other hardware tool. The research includes identification of modular building blocks through a suitable model-based systems design, with SysML models, Simulink models, and Beckhoff TwinCAT software. The novel HIL scheme is presented accompanied by experimental results of a composite module, which consists of four sub-modules.