Loading [MathJax]/extensions/TeX/ietmacros.js
Modeling and Optimization of Class-E Amplifier at Subnominal Condition in a Wireless Power Transfer System for Biomedical Implants | IEEE Journals & Magazine | IEEE Xplore

Modeling and Optimization of Class-E Amplifier at Subnominal Condition in a Wireless Power Transfer System for Biomedical Implants


Abstract:

For the class-E amplifier in a wireless power transfer (WPT) system, the design parameters are always determined by the nominal model. However, this model neglects the co...Show More

Abstract:

For the class-E amplifier in a wireless power transfer (WPT) system, the design parameters are always determined by the nominal model. However, this model neglects the conduction loss and voltage stress of MOSFET and cannot guarantee the highest efficiency in the WPT system for biomedical implants. To solve this problem, this paper proposes a novel circuit model of the subnominal class-E amplifier. On a WPT platform for capsule endoscope, the proposed model was validated to be effective and the relationship between the amplifier's design parameters and its characteristics was analyzed. At a given duty ratio, the design parameters with the highest efficiency and safe voltage stress are derived and the condition is called `optimal subnominal condition.' The amplifier's efficiency can reach the highest of 99.3% at the 0.097 duty ratio. Furthermore, at the 0.5 duty ratio, the measured efficiency of the optimal subnominal condition can reach 90.8%, which is 15.2% higher than that of the nominal condition. Then, a WPT experiment with a receiving unit was carried out to validate the feasibility of the optimized amplifier. In general, the design parameters of class-E amplifier in a WPT system for biomedical implants can be determined with the proposed optimization method in this paper.
Published in: IEEE Transactions on Biomedical Circuits and Systems ( Volume: 11, Issue: 1, February 2017)
Page(s): 35 - 43
Date of Publication: 15 June 2016

ISSN Information:

PubMed ID: 27323372

Funding Agency:


Contact IEEE to Subscribe

References

References is not available for this document.