Effect of solder voids in brazing on microwave signal transmission performance

Grounding is an important technology of microwave circuits. Brazing process can realize the grounding of microwave chip. However, the solder voids in brazing can make the reliability of grounding worse, deteriorating heat conduction performance and conductive properties, resulting in an error in signal transmission and significantly reduce the transmission performance of microwave signal. As the device operating frequency goes higher, solder voids can lead to serious signal integrity problems, for this reason, influence of different positions, sizes and number of void in brazing on signal transmission performance of microwave were investigated. The result shows that the void close to the feeding port has the greatest influence on the signal transmission performance, the signal transmission performance worsens with the volume of void enlarging, in addition, below the transmission line, with the increasing in number of voids, the signal transmission performance is deteriorated.