Study on electrical characteristics of micron-order wiring with nano-scale conductive metal particle

In recent years, the substrate which achieves low-cost manufacturing and high density wiring is strongly demanded for the next generation high performance computing. Therefore, we developed the process of micron-order wiring with printing nano-scale conductive particle. This process has two noble technologies. One is micron order trench forming and another is printing and sintering. In this time, we developed micron order wiring based on above process. Furthermore, we checked DC/AC characteristics and high speed transmission capability on eye patterns of micron order wiring. In this paper, we discuss three items. One is the fine wiring formation process with the paste including nano-scale conductive particle (Cu nano paste). Two is the AC characteristics measured with TEG. The last is electric characteristic on eye pattern analysis results using the actual measurement result. From these experiments, we mention the advantages and disadvantages of micron-order wiring with Cu nano paste.