A 1.1 nm oxide equivalent gate insulator formed using TiO/sub 2/ on nitrided silicon

Tunneling leakage limits the scaling of SiO/sub 2/ to about 1.5 nm. Well behaved transistors have previously been made with MOCVD-deposited TiO/sub 2/ using the thermal decomposition of titanium tetrakis isopropoxide. However, after the required O/sub 2/ anneal, these devices have a 2.5 nm amorphous interfacial layer which severely limits the capacitance. We have synthesized nitrato titanium (Ti(NO/sub 3/)/sub 4/ or NT) as a hydrogen and carbon free deposition. In an effort to obtain low leakage, /spl sim/1.0 nm GOE slacks, we have used NT to deposit progressively thinner TiO/sub 2/ layers on silicon that has been thermally nitrided at 850/spl deg/C in NH/sub 3/ at 10 torr. The article shows film morphology representative of device deposition (500/spl deg/C). TiO/sub 2/ deposition rates were /spl sim/0.8 nm/min. A post deposition anneal of 700/spl deg/C was done in N/sub 2/. These anatase films are stable up to approximately 850/spl deg/C. Capacitors were made by Pt sputtering, photolithography, and ion milling. A final 450/spl deg/C H/sub 2/ anneal was done on all samples.