A Two-Level Undercut-Profile Substrate for Chemical-Solution-Based Filamentary Coated Conductors

A recently developed two-level undercut-profile substrate (2LUPS), containing two levels of plateaus connected by a curved wall with an undercut profile, enables self-forming filaments in a coated conductor during physical line-of-sight deposition of buffer and superconducting layers. In the present study, the 2LUPS concept is applied to a commercial cube-textured Ni-5at.%W tape, and the surface of the 2LUPS coated with two Gd
₂
Zr
₂
O
₇
buffer layers using chemical solution deposition is examined. Except for narrow regions near the edge of upper plateaus, the plateaus are found to be covered by strongly textured Gd
₂
Zr
₂
O
₇
buffer layers after dip coating and sintering.