Heat-transfer enhancing features for handler tray-type device carriers

Many test handlers process semiconductor devices in trays which must be rapidly heated or cooled by a forced air flow to a desired test temperature and then back to ambient temperature. This paper describes a new design feature for test-handler tray that significantly increases the rate of convective heat transfer to the tray and the devices in the tray. The improved tray incorporates lateral ribs which breakup thermal boundary layers and enhance mixing. This enhanced heat transfer is especially important in new test-in-tray handlers whose operating speeds can be limited by thermal response times.