Heat dissipation improvement design for QSFP connector

QSFP connector is used for high bandwidth telecommunication and data communication applications. It has strict limitations on the thermal dissipation, the impedance mismatch and the electromagnetic interference. This paper proposes to modify the plastic fixture wafers and to insert additional internal heat sinker, thereby creating an new air flow channel in QSFP connector to enhance the thermal dissipation. Both the software simulation and the hardware measurement are applied to verify the performance of the proposed design. This paper also proposes an improved size design flow for the top-layer heat sinker by using Taguchi method. The designed signal factors, the control levels setup, the mathematical analysis on the simulation results are described to demonstrate the design flow.