Online CVS process control for PCB application the road to efficiency in via and through holes filling

In the recent years, Copper electrodeposition has to get into a new challenge with the raise of Via and Through holes filling in order to achieve new interconnectivity required for miniaturization and high efficiency electronic devices. In those technology, the Via-holes are used to connect the each conductive layer. Organic additives are the key ingredients in the plating solution that influence the properties and quality of the deposits. The organics components in the acid copper plating bath necessary to achieve such plating performances require a closer control than in usual plating baths. The performances of the bath and the quality of the panels produced can drop dramatically if the organics concentration fall out of the working ranges. Cyclic Voltammetric Stripping (CVS) method is an established analytical technique that has long been demonstrated to be applicable to analysis of Copper additives in various plating solutions. The use of an Online CVS equipment will help to control continuously the different organics in the bath and allow to interact immediately if a shift in the results is detected. This paper will described a proprietary Online CVS analyzer, the LineSmart® 8000, and give some example of analysis results made on a production combining Via and Through hole filling.