Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation

We successfully demonstrate for the first time, VCSEL-to-silicon grating coupler flip-chip assembly using SU8 prism fabricated by non-uniform laser ablation. Excess loss of <; 1 dB and data transmission up to 20 Gb/s @ 1550 nm was achieved.