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A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers | IEEE Conference Publication | IEEE Xplore

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers


Abstract:

With an ever increasing number of broadband applications in sub-Saharan Africa, mm-wave point-to-point networking has the potential to fill a niche in communications netw...Show More

Abstract:

With an ever increasing number of broadband applications in sub-Saharan Africa, mm-wave point-to-point networking has the potential to fill a niche in communications network architectures. Widespread adoption of this technology would benefit from conventional RF soft substrate integration and packaging, as opposed to system-on-chip or thick film processes. A review on the state-of-the-art in E-band soft substrate systems reveals significant reliance on MMICs. We propose that hybrid integration of active devices with off-chip passives, as well as better integration of active components in SIW, will lead to better performing E-band systems in soft substrates. Specific enabling techniques from the microwave domain are identified.
Published in: AFRICON 2015
Date of Conference: 14-17 September 2015
Date Added to IEEE Xplore: 19 November 2015
ISBN Information:
Electronic ISSN: 2153-0033
Conference Location: Addis Ababa, Ethiopia

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