Circuit modeling of Cu/CNT composite through-silicon vias (TSV)

In this paper, the CNT TSVs, as well as Cu/CNT composite TSVs, are investigated based on the equivalent circuit model. The effective complex conductivity, which incorporates the kinetic inductive effect of CNTs, has been employed for high-frequency characterization. The performance comparison between Cu, CNT, and Cu/CNT composite TSVs are carried out. It is found that Cu/CNT composite TSVs can be utilized to improve the system reliability without losing much performance.