A Novel Heat Substrate with self-alignment structure for high-power LED packaging

In this work, a novel heat substrate with self-alignment structure is developed for high-power LED packaging. Firstly, fabrication process of the substrate is introduced and alignment behaviors between conventional substrate and self-alignment substrate are compared. Then, experiments are carried out to evaluate the alignment ability of angle adjustment and displacement error. The results show that the alignment accuracy of new substrate is much better than the conventional one without self-alignment structure. Further results show that self-alignment accuracy depended on the chip size and its attachment area. When the two are in the same size, chips align at the center of the chip area, even an original location with angle error about 45° can be decreased to below 0.5°, and the original displacement error about 200μm can be decreased to below 30μm at the same time.