Printed-circuit board model establishment and solder joint failure analysis

For electronic products operating under the vibration environment, generally solder joints fail due to break of the solder joints on the board at the high-stress position. How can we know the high-stress area on the printed-circuit board? Why a high stress is generated in these areas? How can solder joint break and failure be solved? Now the above issues actually exist in the industry. This paper conducts finite element analysis on the circuit board components by using the finite element mathematical computing method in order to analyze the dynamic characteristicss and random vibration features and establish the simulation model. With these experiments, this paper conducts the modal analysis, response analysis and stress distribution analysis of this board. To compare these analysis with the established model and correct and fit the model, this model becomes the relatively accurate simulation model of the printed-circuit board and is applied into the actual electronic products, so it can improve product reliability, accelerate R&D progress and save the cost.