The Improvement of High Temperature Zn- Based Lead Free Solder by the Application of Besi's Programmable Ultrasonic Module (PUM)

Researchers have been working for many years on a Pb-free alternative in soft solder die attach application to comply with the European regulations regarding the use of high-Pb solders in electronics. As of now, Zn-based Pb-free solder has shown to be a very promising substitute to high-Pb solders. A previous study demonstrated that a Zn-based solder with a melting temperature above 330deg C and excellent thermal and electrical properties may serve as a near drop-in alternative to high-Pb solder wire in die attach applications. This paper focuses on further improvements with regards to wettability and reliability of the Zn-based solder by the application of Besi's Programmable Ultrasonic Module (PUM) available on Esec 2009 SSI(exp E) and 2009 fS(exp E) die bonders.