Study of cracking of thin glass interposers intended for microelectronic packaging substrates

Glass interposers have gained increased attention and interest in microelectronics industry since 2010. This is because glass has a tailorable coefficient of thermal expansion (CTE), high mechanical rigidity, availability in large and thin panel form, low processing cost, smooth surface for fine line and space fabrication, and superior electrical properties. While thin glass panels offer such a plethora of benefits, there are several processing and reliability challenges that glass imposes. As a brittle material, glass has low fracture toughness and is prone to cracking.