A novel non-solder based board-to-board interconnection technology for smart mobile and wearable electronics

In this paper, the first demonstration of a novel-concept for an ultra-high density and low-cost, non-solder based interconnection technology, which can be applied for miniaturized board-to-board (BTB) as well as 2nd level package-to-system board interconnections, is reported. This is an array type, dry-fit interconnection technology that is modeled, simulated, designed and fabricated. Such a technology is expected to have many applications in small consumer systems such as smart mobile and wearable electronics. This paper presents three key innovations. The first innovation is the introduction of non-solder based, dry-fit interconnection concept. The second innovation is the demonstration of the reduced interconnection height of 0.45 mm, compared to a typical 0.7∼1.0 mm mating height in most miniaturized BTB connectors in the market [1]. This thin mating height is one of the important features in portable electronics applications [2]. The third innovation is in the manufacturing processes. Unlike conventional BTB connectors, simplified and standard manufacturing processes were applied to build this innovative interconnection structure.