Double Sided Cooled Module concept for High Power Density in HEV Applications

Electric Vehicles (EV) and Hybrid Electric Vehicles (HEV) are expected to be produced and commercialized at a large scale in the coming years. This requires the integration of an electric drive train into a large number of car platforms under massive space and cost constraints. We present a novel power module concept with double sided chip cooling which allows very high power densities. In addition, lower stray inductance and package resistance improvements enable high inverter efficiencies.