Packaging of high speed DFB laser diodes

Today laser diodes can be modulated at high frequencies where parasitics from bond wires, carriers, and housings can deteriorate the laser performance. As a remedy the lasers can be mounted very close to high frequency connectors or alternatively on carefully designed carriers with integrated functions. Flip-chip mounting is especially attractive since it eliminates bond wires, is optimal for heat sinking and it enables passive alignment to optical fibres.