Magnetic microscopy for 3D devices failure localization and analysis

The magnetic microscopy was successfully applied to localize the failure site of the failed SDP memory sample before the decapsulation of the failed sample. The magnetic microscopy pointed the specific (X, Y, Z) coordinate of the failure site and the failure site was confirmed by optical microscopy and SEM analysis. The failure analysis case demonstrated in this article showed the effectiveness of the magnetic microscopy in the failure localization for 3D device.