Structure of Ball Grid Array/Permanent semi-elastomeric thermally conductive crumb rubber reinforced bituminous Stencil/Printed Circuit Board interconnects

An investigation is reported into the structure of Ball Grid Array/Permanent Stencil/Printed Circuit Board interconnects produced when semi-elastomeric bituminous stencils are formed or placed within standard interconnects. Such interconnects have the potential to extend the service life of Printed Circuit Boards especially for use in aviation, shipping and military applications.