Novel intelligent power modules for low-power inverters

In this paper, a series of newly developed intelligent power modules, designed for low power applications (up to 2.2 kW/220-240 V AC) is introduced. The modules are based on two distinct and novel design concepts related to increased integrated functionality and compact housing (packaging). The key technologies utilized are IGBT and diode chip technologies for power functions, control IC technology and module manufacturing and packaging technologies for smart housing of these new modules. The paper describes details of their design and functional capabilities, and projects on future possibilities based on the developed technologies.