An improved SPICE model of phase-change memory (PCM) for peripheral circuits simulation and design

An improved SPICE model is presented in this work, including three coupled modules, the electrical module, thermal module and the phase transition dynamic module. Considering the heterogeneous temperature distribution, a temperature distribution model and a distributed resistor network model based on the semispherical hypothesis of the active area are achieved. The model is submitted by Verilog-A language, and the peripheral drive circuit combined with the PCM cell is simulated. The results show a good fit with measurement. According to the simulation, the peripheral circuit for PCM cells with different structure is optimized.