Sinter paste for power packages

Conductive adhesive, solder paste and solder wire have been commonly used in the electronic industry for die attach on lead frame. However with the constant trend for miniaturization of packages increasing power density is required. The continuous pursuance of a lead-free interconnect material has also been much desired by the industry. The newly developed mAgic sinter paste which was previously established for the DCB substrate is now also available for lead frames. Sinter paste can dissipate heat away from the package much better than both solder paste and conductive adhesive. Sinter paste is also lead and halogen free which makes it an environmental friendly material. In this paper, the properties and application processes of two mAgic sinter paste for die attach on lead frame would be compared. In addition, advantages and limitation of both sinter paste and solder paste would also be discussed.