Development of a low-cost packaging for MEMS pressure sensors

Considerable research efforts have been devoted to the development of MEMS sensor packaging based on different material types (ceramic, plastic and metal). In this work, we describe the design, fabrication and test of a metal packaging with high reliability and low cost. The novelty of our research is on the packaging assembly by mechanical interference replacing the expensive plasma welding process that is used commonly in the development of traditional metal packaging.