PCB pad design for board to board SMP connector

The design of printed circuit board (PCB) pad for SMP connector is presented. A detailed design and parameterization study are performed using HFSS, a commercial finite element tool. The PCB pad for the vertical SMP connector and surface mounted SMP connector are optimized. According to the simulation result, the return loss and insertion loss for SMP-to-microstrip transitions are better than 26 dB and 0.12 dB respectively from DC to 6 GHz, and the return loss and insertion loss for SMP-to-coplanar waveguide (CPW) transitions are better than 10 dB and 0.7 dB respectively up to 26.5 GHz.