Embedded Planar Power Inductor in an Organic Interposer for Package-Level DC Power Grid

To realize the basic technology of a package-level dc power grid for the next generation power delivery to large scale integrated circuits (LSIs), two types of planar spiral inductors embedded in an organic interposer, for several tens of megahertz switching power supply integrated in LSI package, have been proposed. One is a Zn–Fe ferrite core spiral inductor, and another is a hybrid core spiral inductor, with quasi closed magnetic circuit consisting of the bottom Zn–Fe ferrite core and top carbonyl-iron/epoxy composite core. In this paper, the two types of planar spiral inductors have been fabricated and evaluated. From the experimental results, it was found that the hybrid core planar spiral inductor exhibited higher \(Q\) -factor and larger rating dc current than the Zn–Fe ferrite core inductor.