Comparison between organic and ceramic substrate insulation

A study and comparison of substrates with ceramic and organic electrically insulating and thermally conductive layers for power electronic packages is presented. Reference is made to the “die on leadframe”-technology, to compare these structures with a commercial ceramic substrate. The focus of the study is on the thermal properties of the structures. Furthermore, a comprehensive overview of test methods and results for the breakdown voltage and the sheer strengths of the tested organic layers is given. The test results will be evaluated, if organic layers could be used as a substitute for standard ceramic substrates.