Dynamic Stack-Controlled CMOS RF Power Amplifier for Wideband Envelope Tracking

In this paper, a dynamic stack-controlled CMOS FET RF power amplifier (PA) is developed to enhance the efficiency of the envelope tracking power amplifier (ET PA) system for low-voltage operation. The power cell used in the two-stage PA is a quadruple-stacked FET structure with dynamic stacking controller to reconfigure the power cell into the quasi-triple or quasi-double stacks according to the magnitude of the input envelope signal. The proposed power cell boosts the peak efficiency in the low V
_DD
region by bypassing the stack entering the triode region and reoptimizing the load impedance so that all the FETs operate under the saturation and the optimum load conditions. A detailed analysis is presented to understand the gain and phase step discontinuities at the stack switching points, and the circuit techniques to equalize the gain and phase between the adjacent stack configurations are developed. The proposed two-stage stack-controlled PA is fabricated with a 0.32-μm silicon-on-insulator (SOI) CMOS process together with the envelope amplifier (EA). Full long-term evolution (LTE) characterization is performed using LTE signals with a peak-to-average power ratio (PAPR) of 6.7 dB and signal bandwidths (BW) of 10 and 20 MHz. With 10-MHz signals, dynamic stacking provides 3.5% power added efficiency (PAE) improvement over the static stack at 25.7 dBm, resulting in 47.5% PAE with 26.6-dB gain. A 20-MHz LTE test shows an overall PAE of 45.9% with an evolved universal terrestrial radio access (E-UTRA) adjacent channel leakage ratio (ACLR) of -33 dBc with memoryless digital predistortion. Even with the lower efficiency of the EA compared with the state-of-the-art results, the measured overall system efficiency with 3.4 V maximum voltage is comparable with those reported using GaAs HBT's with 5 V supplies, which clearly demonstrates the advantages of the proposed dynamic stack control.