Effect of package thermal warpage for POP assembling technique

POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. The paper introduces the POP assembling procedure, aims to test and results analysis the effect of package warpage for POP assembling technique, summarizes the measurements for minimizing the package warpage.