Thermal analysis for COB based on glass substrate

As a novel packaging material, glass has good light transmission and insulation, getting people's attention. In the paper, ANSYS software was used to simulate heat dissipation performance of the chip-on-board for LED chips packaging on glass substrate, analyze effects of the substrate material, substrate thickness, chip gaps, chip sizes and convection conditions on COB heat dissipation performance based on glass substrate. Finally, by ANSYS software an optimized analysis was made to optimize the thermal management scheme of COB based on glass substrate, find the optimized packaging structure, so that it could be used in actual production.